OMAP-L138: Verify settings to run application from NAND flash: 300 Mhz processor and 102 MHz DDR2

Part Number:OMAP-L138

Dear Team,

I am working on TI’s TMDSLCDK138 evaluation board.

In that I want to run my application at 300 MHz processor speed and 102 MHz DDR2.

In debug mode, using OMAP-L138_LCDK.gel script I am able to run it

Now I want to load my application (boot.ais and program.bin) in NAND flash so that my application will boot from NAND to run independently after reset at 300 MHz processor speed and 102 MHz DDR2 speed.

So I made changes (which is given below in table with yellow colour background) in the settings of PLL1 Multiplier and DDR2 function of NAND boot loader program (comes with the OMAPL138_StarterWare_1_10_04_01) as below

Also I made change in the boot loader program

In DDR2 configuration function “DDRInit” in “bl_platform.c” file at line number 512 of bootloader program, I change “freq” variable to “102” instead of “150”

const float freq = 102;

I use the below utilities to download in NAND flash

i)        bootloader program (boot.out),

ii)       aisgen_d800k008.exe(to generate boot.ais),

iii)     out2rprc.exe,

iv)     sfh_OMAP-L138.exe,

Observation: After reset my application is not working properly, it hangs/ reset after some second

Note: If I do the same sequence with default setting given in boot loader program (i.e 300 MHz processor speed and 150 MHz DDR2 speed) then my application is running

Please suggest that if I need to make any other change