Part Number:OMAP-L138
Hi team,
Posting for a colleague:
We are validating a TI OMAP device designed into a new product, PN OMAPL138EZWT4. The OMAP datasheet makes the following declarations:
From omap-l138.pdf, 4.1 Absolute Maximum Ratings Over Operating Junction Temperature, pg 77
http://www.ti.com/lit/ds/symlink/omap-l138.pdf
Max Operating Junction Temperature, TJ 90°C (Commercial)
Package NFBGA ZWT 361 pins
From omap-l138.pdf, Table 7-2 Thermal Resistance Characteristics (PBGA Package [ZWT], pg 279)
http://www.ti.com/lit/ds/symlink/omap-l138.pdf
θja = 23.7°C/W
θjc = 7.3°C/W
ψJT = 0.2°C/W
From omap-l138.pdf, Table 4-1 Recommended Power-On Hours, pg 80
Silicon Revision E, Speed grade 456MHz - 100,000 hours
I’d like to obtain reliability data (FIT, MTBF, Power on-hours) for each of the OMAP operating conditions below:
Tj = 90°C (max operation temperature guaranteed in datasheet)
Tj = 82.1°C (calculated from Tc=77.9°C, using Pd=0.58W)
Tj = 72°C (20% lower than datasheet maximum specified)
Thank you for the help,
Nate