Part Number:TMS320C6748
Hi,
We are using TMS320C6748EZWTD4 on our board (14 layer). The core utilization is around 70% with maximum power consumption of 0.6W to 0.63W.
From each of the BGA ground pins, we have vias, which are then connected to ground planes. These vias run from layer 2 to layer 13.
In most of the layers, we have relatively large copper pouring, all of which are connected to ground planes.
We would like to know how effective is the heat dissipation of this processor from the junction to board. Will using large amounts of copper pouring effectively steer away the heat from the component?
Our thermal analysis team claims that the heat dissipation for this kind of BGAs will be mostly through junction to case rather than junction to board and hence copper pouring is not effective.
We have limitations on our board which does not permit us to use heat sinks. Please help us to understand this.
Regards,
Archana Rao