Part Number:OMAP-L138
We have downloaded the reference design(including BOM,Schematic diagram and Layout file) of TMDSLCDK138 board from ti site http://www.ti.com/tool/tmdslcdk138,
In BOM,it is mentioned in manufacturing part column as W971GG6KB-25 (Winbond) and in Value column it is mentioned K4T1G164QF-BCE7 (Samsung)
, while in name .brd file it's K4T1G164QF-BCF7 and in actual pcb it's W971GG6KB-25 .
Please let us know why there is a so many conflicting item even if we downloaded data for a latest Evaluation board from a authentic TI website.
Also the revision number in the board is not given by ti.
Please send the correct bom, schematic and layout i.e. .brd file forTMDSLCDK138 evaluation board.
Regards,
Satheesh