All,
My customer uses AM1808 in HMI board, software is based on Linux. This module is not mission critical, but lutch-up is not acceptable because of usability. The customer uses silicon revision 2.1. MCU and memory are shielded on board.
In the newest Errata (SPRZ313G.pdf, pages 5-6 ) TI confirms AM1808 has ESD Immunity issue and TI provides some solution how to avoid the problem. New PCB design has been completed according to Errata recommendations. Unfortunately there is not dramatical improvment: latch-up happens at 50- 60% times against 100% before.
2 questions:
- Can you advise me are any ESD Immunity improvments expected in new Rev 2.3?
- Does anybody have any success stories with AM1808 and IEC 61000-6-5 test? It seems to me no chance to fully solve this issue.
Best regards,
Dmitry Tcholovsky